Define the question
Source, package, lifecycle, application, suspected failure mode, and decision criteria establish the plan.
Vyrian Engineering Labs
Test with purpose. Report with clarity.
Vyrian’s official laboratory brochure presents a technical resource for authenticity, condition, material, construction, assembly, and performance questions across electronic components.
Independent technical evidence
The test plan starts with the decision—not the instrument.
A useful laboratory scope reflects the component technology, available traceability, source risk, program requirements, and the specific question the customer needs answered. Methods are sequenced to protect evidence and make responsible use of samples.
Read the 36-page lab brochure
Laboratory workflow
From risk definition to an actionable result.
Each stage preserves context so observations and data can be understood by the teams responsible for disposition.
Sequence the methods
Non-destructive inspection generally precedes methods that alter or consume samples.
Generate evidence
Instrument outputs, photographs, measurements, and observations are recorded against the agreed scope.
Report for action
Findings are organized so sourcing, quality, and engineering teams can make a documented decision.
Inspection and analysis
A layered view of the component.
The official brochure covers non-destructive and destructive methods spanning external condition, material composition, internal construction, assembly readiness, and electrical behavior.
Visual inspection
Package, body, leads, balls, markings, surfaces, labels, and dimensional characteristics are examined for consistency and condition.
Marking permanency
Approved methods evaluate marking durability and possible resurfacing indicators.
XRF analysis
X-ray fluorescence supports elemental characterization, lead-finish evaluation, and restricted-substance questions.
LIBS analysis
Laser-induced breakdown spectroscopy provides elemental data useful for material and construction review.
Radiography
X-ray inspection reveals internal construction, die orientation, wire bonds, voiding, damage, and assembly anomalies without opening the package.
Delid and decapsulation
Controlled package opening exposes die markings, bond wires, lead frame, and internal construction for direct examination.
Electrical testing
Parametric, functional, or comparative electrical checks can be selected around the device and available test conditions.
Solderability
Wetting behavior and lead or termination condition are evaluated using methods appropriate to the component type.
Destructive analysis
Cross-sectioning, die examination, and other invasive methods can answer questions that non-destructive inspection cannot resolve.
Technology matched to the task
Different questions require different evidence.
OpticalHigh-magnification visual inspection, dimensional review, surface and marking examination
AnalyticalXRF and LIBS material characterization for elemental and finish-related questions
RadiologicalTwo-dimensional X-ray examination of internal construction and assembly features
MechanicalPackage opening, cross-section preparation, solderability, and sample conditioning
ElectricalDevice-appropriate parametric, functional, comparative, or curve-trace testing
Methods and standards
Technical work anchored in recognized practice.
Vyrian’s laboratory brochure references industry and customer-defined methods across counterfeit avoidance, inspection, material evaluation, radiography, solderability, and electrical testing. The applicable revision, sampling plan, acceptance criteria, and report scope should be agreed for each project.
Reporting
Evidence arranged for review.
Reports can bring together the scope, samples, methods, equipment context, images, measurements, results, observations, and conclusions needed to support the customer’s decision path.
Need a test plan for a specific part or lot?
Share the component, source context, available documentation, sample quantity, and the question the program needs to answer.